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1

Intramolecular hydrosilation of acetylenes: Regioselective functionalization of homopropargyl alcohols

Kohei Tamao, Kimio Maeda, Tetsu Tanaka, Yoshihiko Ito

Journal:

Tetrahedron Letters

Year:

1988

Language:

english

File:

PDF, 156 KB

english, 1988

2

Report on 640 Victims of the Tokyo Subway Sarin Attack

Tetsu Okumura, Nobukatsu Takasu, Shinichi Ishimatsu, Shou Miyanoki, Akihiro Mitsuhashi, Keisuke Kumada, Kazutoyo Tanaka, Shigeaki Hinohara

Journal:

Annals of Emergency Medicine

Year:

1996

Language:

english

File:

PDF, 601 KB

english, 1996

3

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Loss evaluation of an AC-AC direct converter with a new GaN HEMT SPICE model

Okamoto, Masayuki, Toyoda, Genki, Hiraki, Eiji, Tanaka, Toshihiko, Hashizume, Tamotsu, Kachi, Tetsu

Year:

2011

Language:

english

File:

PDF, 1.34 MB

english, 2011

4

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV

Sugawara, Yohei, Hashiguchi, Hideto, Tanikawa, Seiya, Kino, Hisashi, Lee, Kang-Wook, Fukusima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Year:

2015

Language:

english

File:

PDF, 1.12 MB

english, 2015

5

Impacts of land use changes from the Hanoi Master Plan 2030 on urban heat islands: Part 1. Cooling effects of proposed green strategies

Kubota, Tetsu, Lee, Han Soo, Trihamdani, Andhang Rakhmat, Phuong, Tran Thi Thu, Tanaka, Takahiro, Matsuo, Kaoru

Journal:

Sustainable Cities and Society

Year:

2017

Language:

english

File:

PDF, 7.37 MB

english, 2017

6

Tunnel field-effect transistor charge-trapping memory with steep subthreshold slope and large memory window

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Journal:

Japanese Journal of Applied Physics

Year:

2018

Language:

english

File:

PDF, 1.09 MB

english, 2018

7

Onâwafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for throughâsilicon via applications: Comparison to plasmaâenhanced chemical vapor deposition SiO 2

Fukushima, Takafumi, Murugesan, Mariappan, Bea, JiâCheol, Hashimoto, Hiroyuki, Kino, Hisashi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Polymer Science

Year:

2020

File:

PDF, 4.49 MB

2020

8

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - 7-Î¼m-thick NCF technology with low-height solder microbump bonding for 3D integration

Miwa, Yuki, Kumahara, Kousei, Lee, Sungho, Liang, Rui, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2020

File:

PDF, 1.11 MB

2020

9

Natural convective heat transfer from a vertical isothermal surface to a non-Newtonian Sutterby fluid

Fujii Tetsu, Miyatake Osamu, Fujii Motoo, Tanaka Hiroshi, Murakami Kentaro

Journal:

International Journal of Heat and Mass Transfer

Year:

1973

Language:

english

File:

PDF, 788 KB

english, 1973

10

Analytical surface potential expression for thin-film double-gate SOI MOSFETs

Kunihiro Suzuki, Tetsu Tanaka, Yoshiharu Tosaka, Hiroshi Horie, Yoshihiro Arimoto, Takashi Itoh

Journal:

Solid-State Electronics

Year:

1994

Language:

english

File:

PDF, 424 KB

english, 1994

11

[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - Thermomechanical reliability challenges induced by high density Cu TSVs and metal micro-joining for 3-D ICs

Lee, Kangwook, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2012

Language:

english

File:

PDF, 4.28 MB

english, 2012

12

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Kang-Wook Lee,, Ji-Chel Bea,, Ohara, Yuki, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.26 MB

english, 2014

13

Thermal fluctuation for the time-dependent Ginzburg-Landau simulation

Ichitsubo, Tetsu, Tanaka, Katsushi

Journal:

Physical Review E

Year:

2001

Language:

english

File:

PDF, 69 KB

english, 2001

14

Kinetics of cubic to tetragonal transformation under external field by the time-dependent Ginzburg-Landau approach

Ichitsubo, Tetsu, Tanaka, Katsushi, Koiwa, Masahiro, Yamazaki, Yoshihiro

Journal:

Physical Review B

Year:

2000

Language:

english

File:

PDF, 409 KB

english, 2000

15

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2010

Language:

english

File:

PDF, 666 KB

english, 2010

16

Micro/Nano-Structures and Hydrogen Absorption/Desorption Properties of Mg/Cu Super-Laminates

Tanaka, Koji, Kiyobayashi, Tetsu, Takeichi, Nobuhiko, Miyamura, Hiroshi, Kikuchi, Shiomi

Journal:

Materials Science Forum

Year:

2010

Language:

english

File:

PDF, 8.22 MB

english, 2010

17

[IEEE 2014 International 3D Systems Integration Conference (3DIC) - Kinsdale, Ireland (2014.12.1-2014.12.3)] 2014 International 3D Systems Integration Conference (3DIC) - Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Inoue, Fumihiro, Philipsen, Harold, van der Veen, Marleen H., Vandersmissen, Kevin, Van Huylenbroeck, Stefaan, Struyf, Herbert, Tanaka, Tetsu

Year:

2014

Language:

english

File:

PDF, 1.05 MB

english, 2014

18

Glycoblotting method allows for rapid and efficient glycome profiling of human Alzheimer’s disease brain, serum and cerebrospinal fluid towards potential biomarker discovery

Gizaw, Solomon T., Ohashi, Tetsu, Tanaka, Masakazu, Hinou, Hiroshi, Nishimura, Shin-Ichiro

Journal:

Biochimica et Biophysica Acta (BBA) - General Subjects

Year:

2016

Language:

english

File:

PDF, 1.29 MB

english, 2016

19

Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

Ito, Yuka, Fukushima, Takafumi, Kino, Hisashi, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Journal of Microelectromechanical Systems

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

20

Prognostic significance of pathological response to preoperative chemoradiotherapy in patients with locally advanced rectal cancer

Tomono, Ayako, Yamashita, Kimihiro, Kanemitsu, Kiyonori, Sumi, Yasuo, Yamamoto, Masashi, Kanaji, Shingo, Imanishi, Tatsuya, Nakamura, Tetsu, Suzuki, Satoshi, Tanaka, Kenichi, Kakeji, Yoshihiro

Journal:

International Journal of Clinical Oncology

Year:

2016

Language:

english

File:

PDF, 512 KB

english, 2016

21

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Kino, Hisashi, Hashiguchi, Hideto, Tanikawa, Seiya, Sugawara, Yohei, Ikegaya, Shunsuke, Fukushima, Takafumi, Koyanagi, Mitsumasa, Tanaka, Tetsu

Year:

2015

Language:

english

File:

PDF, 1.03 MB

english, 2015

22

Colorimetric Detection of an Airborne Remote Photocatalytic Reaction Using a Stratified Ag Nanoparticle Sheet

Degawa, Ryo, Wang, Pangpang, Tanaka, Daisuke, Park, Susie, Sakai, Nobuyuki, Tatsuma, Tetsu, Okamoto, Koichi, Tamada, Kaoru

Journal:

Year:

2016

Language:

english

File:

PDF, 2.95 MB

english, 2016

23

Heterogeneous 3-D Integration Using Self-Assembly and Electrostatic Bonding

Koyanagi, Mitsumasa, Fukushima, Takafumi, Lee, Kang-Wook, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.43 MB

english, 2016

24

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2016

Language:

english

File:

PDF, 980 KB

english, 2016

25

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

Kino, Hisashi, Tashiro, Masataka, Sugawara, Yohei, Tanikawa, Seiya, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2017

Language:

english

File:

PDF, 659 KB

english, 2017

26

A remark on modified Morrey spaces on metric measure spaces

SAWANO, Yoshihiro, SHIMOMURA, Tetsu, TANAKA}, Hitoshi

Journal:

Hokkaido Mathematical Journal

Year:

2018

Language:

english

File:

PDF, 381 KB

english, 2018

27

[IMPERIAL COLLEGE PRESS Proceedings of the Final Symposium of the Tohoku University 21st Century Center of Excellence Program - Sendai International Center, Japan (7 – 9 January 2007)] Future Medical Engineering Based on Bionanotechnology - BIOLOGICALLY INSPIRED VISION CHIP FABRICATED USING 3-DIMENSIONAL INTEGRATION TECHNOLOGY

KURINO, HIROYUKI, NAKAGAWA, YOSHIHIRO, NAKAMURA, TOMONORI, YAMADA, YUSUKE, LEE, KANG-WOOK, TANAKA, TETSU, KOYANAGI, MITSUMASA

Language:

english

File:

PDF, 693 KB

english

28

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Fukushima, Takafumi, Murugesan, Mariappan, Ohsaki, Shin, Hashimoto, Hiroyuki, Bea, Jichoel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

29

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

Mariappan, Murugesan, Bea, JiChel, Fukushima, Takafumi, Motoyoshi, Makoto, Tanaka, Tetsu, Koyanagi, Mitsumasa

Year:

2016

Language:

english

File:

PDF, 534 KB

english, 2016

30

Butyrate-Producing Probiotics Reduce Nonalcoholic Fatty Liver Disease Progression in Rats: New Insight into the Probiotics for the Gut-Liver Axis

Endo, Hitoshi, Niioka, Maki, Kobayashi, Noriko, Tanaka, Mamoru, Watanabe, Tetsu, Zang, Mengwei

Journal:

Year:

2013

Language:

english

File:

PDF, 22.52 MB

english, 2013

31

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Fukushima, Takafumi, Konno, Takayuki, Iwata, Eiji, Kobayashi, Risato, Kojima, Toshiya, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2011

Language:

english

File:

PDF, 1.40 MB

english, 2011

32

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Fukushima, Takafumi, Hashiguchi, Hideto, Yonekura, Hiroshi, Kino, Hisashi, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa

Journal:

Year:

2016

Language:

english

File:

PDF, 4.07 MB

english, 2016

33

SAE Technical Paper Series [SAE International SAE 2011 World Congress & Exhibition - (APR. 12, 2011)] SAE Technical Paper Series - Development of HMI and Telematics Systems for a Reliable and Attractive Electric Vehicle

Yoshizawa, Shoichi, Tanaka, Yoichiro, Ohyamaguchi, Masahiro, Kitazaki, Satoshi, Kuroda, Kouichi, Sato, Shinpei, Obata, Tetsu, Hirokawa, Yuumi, Iwasaki, Masayasu, Maruyama, Kenji

Year:

2011

Language:

english

File:

PDF, 7.31 MB

english, 2011

34

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Self-Assembly Technologies for FlexTrate™

Fukushima, Takafumi, Susumago, Yuki, Kino, Hisashi, Tanaka, Tetsu, Alam, Arsalan, Hanna, Amir, Iyer, Subramanian

Year:

2018

File:

PDF, 1.32 MB

2018

35

Detrimental Effect of Chronic Hypertension on Leptomeningeal Collateral Flow in Acute Ischemic Stroke

Fujita, Kyohei, Tanaka, Kanta, Yamagami, Hiroshi, Ide, Toshihiro, Ishiyama, Hiroyuki, Sonoda, Kazutaka, Satow, Tetsu, Takahashi, Jun C., Ihara, Masafumi, Koga, Masatoshi, Yokota, Takanori, Toyoda, Kaz

Journal:

Year:

2019

Language:

english

File:

PDF, 376 KB

english, 2019

36

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

Susumago, Yuki, Jacquemond, Achille, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi

Year:

2019

Language:

english

File:

PDF, 2.06 MB

english, 2019

37

[IEEE 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Singapore, Singapore (2019.3.12-2019.3.15)] 2019 Electron Devices Technology and Manufacturing Conference (EDTM) - Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2019

Language:

english

File:

PDF, 467 KB

english, 2019

38

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Lee, Sungho, Liang, Rui, Miwa, Yuki, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2019

Language:

english

File:

PDF, 736 KB

english, 2019

39

Targeted DNA demethylation of the Fgf21 promoter by CRISPR/dCas9-mediated epigenome editing

Hanzawa, Nozomi, Hashimoto, Koshi, Yuan, Xunmei, Kawahori, Kenichi, Tsujimoto, Kazutaka, Hamaguchi, Miho, Tanaka, Toshiya, Nagaoka, Yuya, Nishina, Hiroshi, Morita, Sumiyo, Hatada, Izuho, Yamada, Tetsu

Journal:

Scientific Reports

Year:

2020

Language:

english

File:

PDF, 2.41 MB

english, 2020

40

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs

Miwa, Yuki, Lee, Sungho, Liang, Rui, Kumahara, Kousei, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu

Year:

2019

File:

PDF, 855 KB

2019

41

Significant Die-Shift Reduction and Î¼LED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

Fukushima, Takafumi, Susumago, Yuki, Qian, Zhengyang, Shima, Chidai, Du, Bang, Takahashi, Noriyuki, Nagata, Shuta, Odashima, Tomo, Kino, Hisashi, Tanaka, Tetsu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.59 MB

2020

42

Seroepidemiological study of human herpesvirus-6 and -7 in children of different ages and detection of these two viruses in throat swabs by polymerase chain reaction

Tanaka-Taya, Keiko, Kondo, Toshio, Mukai, Tetsu, Miyoshi, Hiroko, Yamamoto, Yoshiko, Okada, Shintaro, Yamanishi, Koichi

Journal:

Journal of Medical Virology

Year:

1996

Language:

english

File:

PDF, 720 KB

english, 1996

43

Distribution and Ultrastructure of Afferent Fibers in the Parietal Peritoneum of the Rat

Koichi Tanaka, Tetsu Hayakawa, Seishi Maeda, Sachi Kuwahara-Otani, Makoto Seki

Journal:

The Anatomical Record Advances in Integrative Anatomy and Evolutionary Biology

Year:

2011

Language:

english

File:

PDF, 570 KB

english, 2011

44

Direct synaptic contacts on the myenteric ganglia of the rat stomach from the dorsal motor nucleus of the vagus

Tetsu Hayakawa, Sachi Kuwahara, Seishi Maeda, Koichi Tanaka, Makoto Seki

Journal:

The Journal of Comparative Neurology

Year:

2006

Language:

english

File:

PDF, 3.09 MB

english, 2006

45

The roles of intrahepatic Vα14+ NK1.1+ T cells for liver injury induced by Salmonella infection in mice

Masatoshi Ishigami, Hitoshi Nishimura, Yoshikazu Naiki, Kentaro Yoshioka, Tetsu Kawano, Yujiro Tanaka, Masaru Taniguchi, Shinichi Kakumu, Yasunobu Yoshika

Journal:

Year:

1999

Language:

english

File:

PDF, 1.09 MB

english, 1999

46

DCP-LA stimulates AMPA receptor exocytosis through CaMKII activation due to PP-1 inhibition

Takeshi Kanno, Takahiro Yaguchi, Tetsu Nagata, Akito Tanaka, Tomoyuki Nishizaki

Journal:

Journal of Cellular Physiology

Year:

2009

Language:

english

File:

PDF, 273 KB

english, 2009

47

Indomethacin enhances learning and memory potential by interacting with CaMKII

Takeshi Kanno, Takahiro Yaguchi, Tetsu Nagata, Tadashi Shimizu, Akito Tanaka, Tomoyuki Nishizaki

Journal:

Journal of Cellular Physiology

Year:

2012

Language:

english

File:

PDF, 729 KB

english, 2012

48

Natural convective heat-transfer from a vertical surface of uniform heat flux to a non-newtonian sutterby fluid

Fujii Tetsu, Miyatake Osamu, Fujii Motoo, Tanaka Hiroshi, Murakami Kentaro

Journal:

International Journal of Heat and Mass Transfer

Year:

1974

Language:

english

File:

PDF, 461 KB

english, 1974

49

End-tidal CO2 and plasma lactate level: a comparison of their use as parameters for evaluating successful CPR

Shigehito Sato, Tetsu Kimura, Naomitsu Okubo, Toshihiro Naganuma, Makoto Tanaka

Journal:

Year:

1993

Language:

english

File:

PDF, 460 KB

english, 1993

50

Development of the RF-IGISOL at CYRIC

Tetsu Sonoda, Masahiro Fujita, Akiyoshi Yamazaki, Takuya Endo, Tsutomu Shinozuka, Yuji Miyashita, Nozomi Sato, Atsushi Goto, Eiji Tanaka, Tomokazu Suzuki, Toru Miyake, Minoru Tanigaki, Michiharu Wada

Journal:

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms

Year:

2007

Language:

english

File:

PDF, 391 KB

english, 2007